Hideta Arai

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,820,414
- Issue date Oct 27, 2020
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,791,631
- Issue date Sep 29, 2020
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, and current collector, electrode, and...
- Patent number 10,529,992
- Issue date Jan 7, 2020
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil for printed circuit
- Patent number 10,472,728
- Issue date Nov 12, 2019
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 10,464,291
- Issue date Nov 5, 2019
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil
- Patent number 10,383,222
- Issue date Aug 13, 2019
- JX Nippon Mining & Metals Corporation
- Atsushi Miki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board, electronic device, catheter, and metallic mat...
- Patent number 10,194,534
- Issue date Jan 29, 2019
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 9,724,896
- Issue date Aug 8, 2017
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil and laminate using the same, printed wi...
- Patent number 9,730,332
- Issue date Aug 8, 2017
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit
- Patent number 9,580,829
- Issue date Feb 28, 2017
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil and laminate using the same
- Patent number 9,504,149
- Issue date Nov 22, 2016
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil and laminate using the same
- Patent number 9,232,650
- Issue date Jan 5, 2016
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal polymer copper-clad laminate and copper foil used fo...
- Patent number 9,060,431
- Issue date Jun 16, 2015
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolled copper or copper-alloy foil provided with roughened surface
- Patent number 9,049,795
- Issue date Jun 2, 2015
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit
- Patent number 8,524,378
- Issue date Sep 3, 2013
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil having glossy surface with excellent oxidation resistan...
- Patent number 6,319,621
- Issue date Nov 20, 2001
- Nikko Materials Company, Limited
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288881
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288884
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND CURRENT COLLECTOR, ELECTRODE, AND...
- Publication number 20180226655
- Publication date Aug 9, 2018
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160546
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160529
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, CATHETER, AND METALLIC MAT...
- Publication number 20180035546
- Publication date Feb 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE HAVING METAL MATERIAL FOR HEAT RADIATION, PRINTED CIRCUIT...
- Publication number 20180035529
- Publication date Feb 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- HIDETA ARAI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Structure Having Metal Material For Heat Radiation, Printed Circuit...
- Publication number 20170347493
- Publication date Nov 30, 2017
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...
- Publication number 20170291397
- Publication date Oct 12, 2017
- JX NIPPON MINING & METALS CORPORATION
- Hajime MOMOI
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface-Treated Copper Foil
- Publication number 20170196083
- Publication date Jul 6, 2017
- JX NIPPON MINING & METALS CORPORATION
- Atsushi Miki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring B...
- Publication number 20160303829
- Publication date Oct 20, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR PRINTED CIRCUIT
- Publication number 20160286665
- Publication date Sep 29, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...
- Publication number 20160212836
- Publication date Jul 21, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...
- Publication number 20160120017
- Publication date Apr 28, 2016
- JX NIPPON MINING & METALS CORPORATION
- HAJIME MOMOI
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil and Laminate Using the Same
- Publication number 20150245477
- Publication date Aug 27, 2015
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WI...
- Publication number 20150237737
- Publication date Aug 20, 2015
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil and Laminate Using the Same
- Publication number 20140355229
- Publication date Dec 4, 2014
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...
- Publication number 20140093743
- Publication date Apr 3, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR PRINTED CIRCUIT
- Publication number 20140057123
- Publication date Feb 27, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface
- Publication number 20140037976
- Publication date Feb 6, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LAMINATE FOR FLEXIBLE WIRING
- Publication number 20130071652
- Publication date Mar 21, 2013
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit
- Publication number 20130011690
- Publication date Jan 10, 2013
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR OF SECONDARY B...
- Publication number 20130011734
- Publication date Jan 10, 2013
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit
- Publication number 20110262764
- Publication date Oct 27, 2011
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Hideta Arai

Person

Patents Grantslast 30 patents

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, copper foil with carrier, laminate, me...

Surface treated copper foil, copper foil with carrier, laminate, me...

Surface-treated copper foil, and current collector, electrode, and...

Copper foil for printed circuit

Copper heat dissipation material, carrier-attached copper foil, con...

Surface-treated copper foil

Printed wiring board, electronic device, catheter, and metallic mat...

Copper heat dissipation material, carrier-attached copper foil, con...

Surface treated copper foil and laminate using the same, printed wi...

Copper foil for printed circuit

Surface treated copper foil and laminate using the same

Surface treated copper foil and laminate using the same

Liquid crystal polymer copper-clad laminate and copper foil used fo...

Rolled copper or copper-alloy foil provided with roughened surface

Copper foil for printed circuit

Copper foil having glossy surface with excellent oxidation resistan...

Patents Applicationslast 30 patents

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

SURFACE-TREATED COPPER FOIL, AND CURRENT COLLECTOR, ELECTRODE, AND...

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, CATHETER, AND METALLIC MAT...

STRUCTURE HAVING METAL MATERIAL FOR HEAT RADIATION, PRINTED CIRCUIT...

Structure Having Metal Material For Heat Radiation, Printed Circuit...

Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...

Surface-Treated Copper Foil

Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring B...

COPPER FOIL FOR PRINTED CIRCUIT

Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...

Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...

Surface Treated Copper Foil and Laminate Using the Same

SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WI...

Surface Treated Copper Foil and Laminate Using the Same

Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...

COPPER FOIL FOR PRINTED CIRCUIT

Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface

LAMINATE FOR FLEXIBLE WIRING

Copper Foil for Printed Circuit

COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR OF SECONDARY B...

Copper Foil for Printed Circuit