Hidetaka Shigi

Person

Ashikagashimo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Connection device and test system
- Patent number 7,541,202
- Issue date Jun 2, 2009
- Renesas Technology Corp.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a semiconductor device with pyramidal bump ele...
- Patent number 7,390,732
- Issue date Jun 24, 2008
- Hitachi, Ltd.
- Takayoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection device and test system
- Patent number 7,285,430
- Issue date Oct 23, 2007
- Hitachi, Ltd.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 7,198,962
- Issue date Apr 3, 2007
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Connection device and test system
- Patent number 6,759,258
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,566,150
- Issue date May 20, 2003
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer wiring substrate and manufacturing method thereof
- Patent number 6,506,982
- Issue date Jan 14, 2003
- Hitachi, Ltd.
- Hidetaka Shigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,455,335
- Issue date Sep 24, 2002
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Connector and probing system
- Patent number 6,305,230
- Issue date Oct 23, 2001
- Hitachi, Ltd.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,197,603
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer wiring board having vent holes and method of making
- Patent number 6,124,553
- Issue date Sep 26, 2000
- Hitachi, Ltd.
- Yasunori Narizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 5,958,600
- Issue date Sep 28, 1999
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization structure and manufacturing method thereof
- Patent number 5,868,949
- Issue date Feb 9, 1999
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structures and method of manufacturing the same
- Patent number 5,753,372
- Issue date May 19, 1998
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and sealing structure and methods for manufacturing t...
- Patent number 5,262,614
- Issue date Nov 16, 1993
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and production thereof
- Patent number 5,208,656
- Issue date May 4, 1993
- Hitachi, Ltd.
- Haruhiko Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of fabricating electric circuit pattern on thi...
- Patent number 5,162,240
- Issue date Nov 10, 1992
- Hitachi, Ltd.
- Norio Saitou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module structure
- Patent number 4,930,002
- Issue date May 29, 1990
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION DEVICE AND TEST SYSTEM
- Publication number 20090209053
- Publication date Aug 20, 2009
- Susumu KASUKABE
- G01 - MEASURING TESTING
Information Patent Application
CONNECTION DEVICE AND TEST SYSTEM
- Publication number 20080009082
- Publication date Jan 10, 2008
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Application
Connection device and test system
- Publication number 20040235207
- Publication date Nov 25, 2004
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method thereof including a p...
- Publication number 20030203521
- Publication date Oct 30, 2003
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Application
Multi-layer wiring substrate and manufacturing method thereof
- Publication number 20030019663
- Publication date Jan 30, 2003
- Hidetaka Shigi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof including a p...
- Publication number 20020182796
- Publication date Dec 5, 2002
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Application
Connection device and test system
- Publication number 20020129323
- Publication date Sep 12, 2002
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Application
Electronic circuit board with built-in thin film capacitor and manu...
- Publication number 20010026444
- Publication date Oct 4, 2001
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hidetaka Shigi

Person

Patents Grantslast 30 patents

Connection device and test system

Method for producing a semiconductor device with pyramidal bump ele...

Connection device and test system

Semiconductor device and manufacturing method thereof including a p...

Connection device and test system

Semiconductor device and manufacturing method thereof including a p...

Multi-layer wiring substrate and manufacturing method thereof

Semiconductor device and manufacturing method thereof including a p...

Connector and probing system

Semiconductor device and manufacturing method thereof including a p...

Multilayer wiring board having vent holes and method of making

Circuit board and method of manufacturing the same

Metalization structure and manufacturing method thereof

Wiring structures and method of manufacturing the same

Circuit board and sealing structure and methods for manufacturing t...

Multilayer wiring substrate and production thereof

Method and apparatus of fabricating electric circuit pattern on thi...

Multi-chip module structure

Patents Applicationslast 30 patents

CONNECTION DEVICE AND TEST SYSTEM

CONNECTION DEVICE AND TEST SYSTEM

Connection device and test system

Semiconductor device and manufacturing method thereof including a p...

Multi-layer wiring substrate and manufacturing method thereof

Semiconductor device and manufacturing method thereof including a p...

Connection device and test system

Electronic circuit board with built-in thin film capacitor and manu...