Hidetaka Yamasaki

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming leads of a semiconductor device
- Patent number 7,077,170
- Issue date Jul 18, 2006
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of forming leads of a packaged semiconductor device
- Publication number 20060237087
- Publication date Oct 26, 2006
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead forming for a semiconductor device
- Publication number 20050076967
- Publication date Apr 14, 2005
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR