Hidetaka Yoshizawa

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Ibaraki, JP

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Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT...
- Publication number 20090143511
- Publication date Jun 4, 2009
- HITACHI CHEMICAL CO., Ltd.
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20090137717
- Publication date May 28, 2009
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Encapsulated Epoxy-Resin Molding Compound, And Electronic Component...
- Publication number 20080039556
- Publication date Feb 14, 2008
- HITACHI CHEMICAL CO., Ltd.
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...