Hideto KATO

Person

Takasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy-containing, isocyanurate-modified silicone resin, photosensit...
- Patent number 11,294,282
- Issue date Apr 5, 2022
- Shin-Etsu Chemical Co., Ltd.
- Kumiko Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
- Patent number 11,262,655
- Issue date Mar 1, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,991,611
- Issue date Apr 27, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer containing silphenylene and polyether structures
- Patent number 10,982,053
- Issue date Apr 20, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate and pattern forming method
- Patent number 10,948,823
- Issue date Mar 16, 2021
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer laminate, method for production thereof, and adhesive composi...
- Patent number 10,658,314
- Issue date May 19, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer laminate and method of producing the same
- Patent number 10,553,552
- Issue date Feb 4, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate and making method
- Patent number 10,453,732
- Issue date Oct 22, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film material and pattern forming process
- Patent number 10,416,559
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate and making method
- Patent number 10,373,903
- Issue date Aug 6, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor apparatus, stacked semiconductor apparatus, encapsula...
- Patent number 10,319,653
- Issue date Jun 11, 2019
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, making method, and laminate
- Patent number 10,297,485
- Issue date May 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor apparatus, stacked semiconductor apparatus and encaps...
- Patent number 10,141,272
- Issue date Nov 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,128,143
- Issue date Nov 13, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,115,622
- Issue date Oct 30, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, resin film, semiconductor device and method of m...
- Patent number 10,026,650
- Issue date Jul 17, 2018
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-curable resin composition and photo-curable dry film using th...
- Patent number 9,971,242
- Issue date May 15, 2018
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 9,887,118
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing micro-structure
- Patent number 9,650,538
- Issue date May 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,653,335
- Issue date May 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary adher...
- Patent number 9,472,438
- Issue date Oct 18, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Temporary bonding adhesive compositions and methods of manufacturin...
- Patent number 9,458,365
- Issue date Oct 4, 2016
- Shin-Etsu Chemical Co., Ltd.
- Tae-Hoon Kim
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Silicone resin, resin composition, resin film, semiconductor device...
- Patent number 9,447,305
- Issue date Sep 20, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,365,681
- Issue date Jun 14, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive for wafer processing, member for wafer processin...
- Patent number 9,334,424
- Issue date May 10, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary adher...
- Patent number 9,263,333
- Issue date Feb 16, 2016
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,096,032
- Issue date Aug 4, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photo-curable resin composition, photo-curable dry film, patterning...
- Patent number 9,012,111
- Issue date Apr 21, 2015
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer process body, wafer processing member, wafer processing tempo...
- Patent number 8,999,817
- Issue date Apr 7, 2015
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive composition, and method of producing thin wafer
- Patent number 8,785,585
- Issue date Jul 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SHEET, HANDLING SHEET FOR THINNED WAFER, METHOD FOR HANDLING THIN W...
- Publication number 20240203755
- Publication date Jun 20, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hideto KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CONTAINING SILPHENYLENE AND POLYETHER STRUCTURES
- Publication number 20190352465
- Publication date Nov 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...
- Publication number 20190354014
- Publication date Nov 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY-CONTAINING, ISOCYANURATE-MODIFIED SILICONE RESIN, PHOTOSENSIT...
- Publication number 20190064666
- Publication date Feb 28, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kumiko Hayashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20190027391
- Publication date Jan 24, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE
- Publication number 20180277415
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE AND MAKING METHOD
- Publication number 20180277472
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LAMINATE AND PATTERN FORMING METHOD
- Publication number 20180107116
- Publication date Apr 19, 2018
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM MATERIAL AND PATTERN FORMING PROCESS
- Publication number 20180107115
- Publication date Apr 19, 2018
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Asai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...
- Publication number 20180102333
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATE AND METHOD OF PRODUCING THE SAME
- Publication number 20180102334
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170154802
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20170154801
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...
- Publication number 20170103932
- Publication date Apr 13, 2017
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...
- Publication number 20170077043
- Publication date Mar 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING TH...
- Publication number 20160357105
- Publication date Dec 8, 2016
- Shin-Etsu Chemical Co., Ltd.
- Satoshi ASAI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD OF M...
- Publication number 20160315025
- Publication date Oct 27, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160189996
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE...
- Publication number 20160122586
- Publication date May 5, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160093522
- Publication date Mar 31, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURIN...
- Publication number 20150024574
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Tae-Hoon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING MICRO-STRUCTURE
- Publication number 20140296380
- Publication date Oct 2, 2014
- Hideto KATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER
- Publication number 20140261978
- Publication date Sep 18, 2014
- SHIN-ETSU CHEMICAL CO., LTD.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...
- Publication number 20140154868
- Publication date Jun 5, 2014
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...
- Publication number 20140106137
- Publication date Apr 17, 2014
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION...
- Publication number 20140011126
- Publication date Jan 9, 2014
- SHIN-ETSU CHEMICAL CO., LTD.
- Shohei TAGAMI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING...
- Publication number 20130323631
- Publication date Dec 5, 2013
- Satoshi ASAI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...
- Publication number 20130302983
- Publication date Nov 14, 2013
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...
- Publication number 20130280886
- Publication date Oct 24, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPO...
- Publication number 20130220687
- Publication date Aug 29, 2013
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Hideto KATO

Person

Patents Grantslast 30 patents

Epoxy-containing, isocyanurate-modified silicone resin, photosensit...

Photosensitive resin composition, photosensitive dry film, and patt...

Wafer processing laminate and method for processing wafer

Polymer containing silphenylene and polyether structures

Laminate and pattern forming method

Wafer laminate, method for production thereof, and adhesive composi...

Wafer laminate and method of producing the same

Wafer laminate and making method

Film material and pattern forming process

Laminate and making method

Semiconductor apparatus, stacked semiconductor apparatus, encapsula...

Semiconductor device, making method, and laminate

Semiconductor apparatus, stacked semiconductor apparatus and encaps...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate and method for processing wafer

Resin composition, resin film, semiconductor device and method of m...

Photo-curable resin composition and photo-curable dry film using th...

Wafer processing laminate, temporary adhesive material for wafer pr...

Method for manufacturing micro-structure

Wafer processing laminate, wafer processing member, temporary bondi...

Wafer processing laminate, wafer processing member, temporary adher...

Temporary bonding adhesive compositions and methods of manufacturin...

Silicone resin, resin composition, resin film, semiconductor device...

Wafer processing laminate, wafer processing member, temporary bondi...

Temporary adhesive for wafer processing, member for wafer processin...

Wafer processing laminate, wafer processing member, temporary adher...

Wafer processing laminate, wafer processing member, temporary bondi...

Photo-curable resin composition, photo-curable dry film, patterning...

Wafer process body, wafer processing member, wafer processing tempo...

Temporary adhesive composition, and method of producing thin wafer

Patents Applicationslast 30 patents

SHEET, HANDLING SHEET FOR THINNED WAFER, METHOD FOR HANDLING THIN W...

POLYMER CONTAINING SILPHENYLENE AND POLYETHER STRUCTURES

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...

EPOXY-CONTAINING, ISOCYANURATE-MODIFIED SILICONE RESIN, PHOTOSENSIT...

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE

LAMINATE AND MAKING METHOD

LAMINATE AND PATTERN FORMING METHOD

FILM MATERIAL AND PATTERN FORMING PROCESS

WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...

WAFER LAMINATE AND METHOD OF PRODUCING THE SAME

WAFER LAMINATE AND MAKING METHOD

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...

SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...

PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING TH...

RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD OF M...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURIN...

METHOD FOR MANUFACTURING MICRO-STRUCTURE

TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...

SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION...

PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING...

TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...

WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPO...