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Hideto Masuki

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  • Shizuoka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Conductive module
    • Patent number 11,876,249
    • Issue date Jan 16, 2024
    • Yazaki Corporation
    • Tomohiro Matsushima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coupling structure of housing members and storage case
    • Patent number 10,855,006
    • Issue date Dec 1, 2020
    • Yazaki Corporation
    • Shigeyuki Ogasawara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Clamp and bus bar module
    • Patent number 10,355,434
    • Issue date Jul 16, 2019
    • Yazaki Corporation
    • Hideto Masuki
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Conductive Module
    • Publication number 20220158310
    • Publication date May 19, 2022
    • YAZAKI CORPORATION
    • Tomohiro Matsushima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLAMP AND BUS BAR MODULE
    • Publication number 20180358766
    • Publication date Dec 13, 2018
    • YAZAKI CORPORATION
    • Hideto Masuki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOUSING MEMBER
    • Publication number 20180175344
    • Publication date Jun 21, 2018
    • YAZAKI CORPORATION
    • Shigeyuki Ogasawara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COUPLING STRUCTURE OF HOUSING MEMBERS AND STORAGE CASE
    • Publication number 20180175522
    • Publication date Jun 21, 2018
    • YAZAKI CORPORATION
    • Shigeyuki Ogasawara
    • H01 - BASIC ELECTRIC ELEMENTS