Hidetomo NISHIMURA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device having a multi-layer...
- Patent number 6,475,901
- Issue date Nov 5, 2002
- Oki Electric Industry Co., Ltd.
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING ELEMENT ISOLATION LAYER
- Publication number 20120164815
- Publication date Jun 28, 2012
- LAPIS Semiconductor Co., Ltd.
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20110207290
- Publication date Aug 25, 2011
- Oki Semiconductor Co., Ltd.
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080296770
- Publication date Dec 4, 2008
- Oki Electric Industry Co., Ltd.
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR REGU...
- Publication number 20060205134
- Publication date Sep 14, 2006
- Oki Electric Industry Co., Ltd.
- Hidetomo NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020072221
- Publication date Jun 13, 2002
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS