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Hidetoshi MIMURA

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  • Toyama-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing apparatus and method of manufacturing semicond...
    • Patent number 11,859,280
    • Issue date Jan 2, 2024
    • Kokusai Electric Corporation
    • Hidetoshi Mimura
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Substrate processing apparatus and method of manufacturing semicond...
    • Patent number 11,453,942
    • Issue date Sep 27, 2022
    • Kokusai Electric Corporation
    • Hidetoshi Mimura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

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    • Patent number D843958
    • Issue date Mar 26, 2019
    • Kokusai Electric Corporation
    • Yusaku Okajima
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

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    • Patent number D842823
    • Issue date Mar 12, 2019
    • Kokusai Electric Corporation
    • Yusaku Okajima
    • D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents