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Hidetsugu Motobe
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Fukushima, JP
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Patents Grants
last 30 patents
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Patent Grant
Resin composition, prepreg, metal foil with resin, metal-clad lamin...
Patent number
10,450,405
Issue date
Oct 22, 2019
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Daisuke Nii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Resin composition, prepreg, metal foil with resin, metal-clad lamin...
Patent number
9,681,541
Issue date
Jun 13, 2017
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Toshiyuki Higashida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin composition for printed wiring board, prepreg, and laminate o...
Patent number
8,470,938
Issue date
Jun 25, 2013
Matsushita Electric Works, Ltd.
Hidetsugu Motobe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Epoxy resin composition for prepreg, prepreg and multilayered print...
Patent number
8,062,750
Issue date
Nov 22, 2011
Matsushita Electric Works, Ltd.
Hidetsugu Motobe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin composition for printed wiring board, prepreg, laminate, and...
Patent number
7,566,501
Issue date
Jul 28, 2009
Matsushita Electric Works, Ltd.
Hidetsugu Motobe
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Prepreg of epoxy resin, hardener, and organodialkyurea promotor
Patent number
6,231,959
Issue date
May 15, 2001
Matsushita Electric Works, Ltd.
Yoshihiko Nakamura
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...
Publication number
20170226276
Publication date
Aug 10, 2017
Panasonic Intellectual Property Management Co., Ltd.
DAISUKE NII
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...
Publication number
20160234934
Publication date
Aug 11, 2016
Panasonic Intellectual Property Management Co., Ltd.
TOSHIYUKI HIGASHIDA
B32 - LAYERED PRODUCTS
Information
Patent Application
Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Print...
Publication number
20090008127
Publication date
Jan 8, 2009
Hidetsugu Motobe
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Prepreg for printed wiring board and copper-clad laminated board
Publication number
20060222856
Publication date
Oct 5, 2006
Katsuhiko Itou
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Resin composition for printed wiring board, prepreg laminate, and p...
Publication number
20060216495
Publication date
Sep 28, 2006
Hidetsugu Motobe
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Resin composition for printed wiring board, prepreg, and laminate o...
Publication number
20060159928
Publication date
Jul 20, 2006
Hidetsugu Motobe
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...