Hideya Yagoura

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 5,412,157
- Issue date May 2, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Hideya Yagoura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser OLB apparatus and method of mounting semiconductor device
- Patent number 5,359,203
- Issue date Oct 25, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuya Hashii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape automated bonding packaged semiconductor device incorporating...
- Patent number 5,157,478
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape including molten resin flow path element for resin pac...
- Patent number 5,064,706
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,055,912
- Issue date Oct 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Murasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device housing with laser diode and light receiving e...
- Patent number 4,945,391
- Issue date Jul 31, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Hideya Yagoura
- G02 - OPTICS
Information Patent Grant
Package structure for semiconductor device
- Patent number 4,839,713
- Issue date Jun 13, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Teraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead bonding device utilizing tape carriers
- Patent number 4,826,068
- Issue date May 2, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Hideya Yagoura
- H01 - BASIC ELECTRIC ELEMENTS

Hideya Yagoura

Person

Patents Grantslast 30 patents

Semiconductor device

Laser OLB apparatus and method of mounting semiconductor device

Tape automated bonding packaged semiconductor device incorporating...

Carrier tape including molten resin flow path element for resin pac...

Semiconductor device

Semiconductor device housing with laser diode and light receiving e...

Package structure for semiconductor device

Outer lead bonding device utilizing tape carriers