Hideyasu Tagusari

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrodeposited copper foil for printed wiring board and method fo...
- Patent number 5,897,761
- Issue date Apr 27, 1999
- Mitsui Mining & Smleting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for printed wiring board and method of...
- Patent number 5,858,517
- Issue date Jan 12, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR