Hideyo Osanai

Person

Shiojiri, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,145,352
- Issue date Nov 19, 2024
- DOWA METALTECH CO, LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing heat radiation member
- Patent number 11,919,288
- Issue date Mar 5, 2024
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat radiating plate and method for producing same
- Patent number 11,162,745
- Issue date Nov 2, 2021
- Dowa Metaltech Co., Ltd.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat radiating plate with supporting members and protrusion members
- Patent number 10,619,948
- Issue date Apr 14, 2020
- Dowa Metaltech Co., Ltd.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 10,510,557
- Issue date Dec 17, 2019
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 9,944,565
- Issue date Apr 17, 2018
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching an electronic part to a copper plate having a s...
- Patent number 9,831,157
- Issue date Nov 28, 2017
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 9,713,253
- Issue date Jul 18, 2017
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of radiator-integrated substrate and radiator-...
- Patent number 9,474,146
- Issue date Oct 18, 2016
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled integrated substrate and manufacturing method of liqu...
- Patent number 9,320,129
- Issue date Apr 19, 2016
- Dowa Metaltech Co., Ltd.
- Hisashi Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fin-integrated substrate and manufacturing method of fin-integrated...
- Patent number 8,927,873
- Issue date Jan 6, 2015
- Dowa Metaltech Co., Ltd.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum bonding member and method for producing same
- Patent number 8,745,841
- Issue date Jun 10, 2014
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 8,039,757
- Issue date Oct 18, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Patent number 8,011,416
- Issue date Sep 6, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing a metal-ceramic circuit board
- Patent number 7,487,585
- Issue date Feb 10, 2009
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 7,393,596
- Issue date Jul 1, 2008
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module member manufactured by wet treatment, and wet treatmen...
- Patent number 7,387,741
- Issue date Jun 17, 2008
- Dowa Mining Co., Ltd.
- Ken Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and a power module employing the same
- Patent number 7,368,665
- Issue date May 6, 2008
- Dowa Mining Co., Ltd.
- Masahiro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic circuit board
- Patent number 7,348,493
- Issue date Mar 25, 2008
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal/ceramic bonding circuit board
- Patent number 7,340,828
- Issue date Mar 11, 2008
- Dowa Mining Co., LTD
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum/ceramic bonding substrate
- Patent number 7,304,378
- Issue date Dec 4, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating substrate boards for semiconductor and power modules
- Patent number 7,276,292
- Issue date Oct 2, 2007
- Dowa Mining Co., Ltd.
- Masahiro Furo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 7,255,931
- Issue date Aug 14, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,256,353
- Issue date Aug 14, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,189,449
- Issue date Mar 13, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 7,159,310
- Issue date Jan 9, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Patent number 7,131,483
- Issue date Nov 7, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,122,243
- Issue date Oct 17, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 7,073,703
- Issue date Jul 11, 2006
- Dowa Mining Co., Ltd.
- Takayuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, process for producing the same and a power module em...
- Patent number 7,008,549
- Issue date Mar 7, 2006
- Dowa Mining Co., Ltd.
- Masahiro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220367316
- Publication date Nov 17, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION MEMBER AND METHOD FOR PRODUCING SAME
- Publication number 20220080704
- Publication date Mar 17, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220032580
- Publication date Feb 3, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20200083062
- Publication date Mar 12, 2020
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME
- Publication number 20200064087
- Publication date Feb 27, 2020
- DOWA METALTECH CO., LTD.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20160211195
- Publication date Jul 21, 2016
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20150284296
- Publication date Oct 8, 2015
- Tokuyama Corporation
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF RADIATOR-INTEGRATED SUBSTRATE AND RADIATOR-...
- Publication number 20150041187
- Publication date Feb 12, 2015
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME
- Publication number 20140083671
- Publication date Mar 27, 2014
- DOWA METALTECH CO., LTD.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140057131
- Publication date Feb 27, 2014
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQU...
- Publication number 20120305292
- Publication date Dec 6, 2012
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED...
- Publication number 20120279761
- Publication date Nov 8, 2012
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING MEMBER AND METHOD FOR PRODUCING SAME
- Publication number 20120152482
- Publication date Jun 21, 2012
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Power module member manufactured by wet treatment, and wet treatmen...
- Publication number 20080230515
- Publication date Sep 25, 2008
- DOWA MINING CO.,LTD
- Ken Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20070089291
- Publication date Apr 26, 2007
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Aluminum/ceramic bonding substrate and method for producing same
- Publication number 20070042215
- Publication date Feb 22, 2007
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Publication number 20070017652
- Publication date Jan 25, 2007
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method of manufacturing a metal-ceramic circuit board
- Publication number 20060242826
- Publication date Nov 2, 2006
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and a power module employing the same
- Publication number 20060062979
- Publication date Mar 23, 2006
- DOWA MINING CO., LTD.
- Masahiro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Aluminum/ceramic bonding substrate
- Publication number 20060043574
- Publication date Mar 2, 2006
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Aluminum bonding member and method for producing same
- Publication number 20050217823
- Publication date Oct 6, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method of manufacturing a metal-ceramic circuit board
- Publication number 20050138799
- Publication date Jun 30, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050084704
- Publication date Apr 21, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050079329
- Publication date Apr 14, 2005
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum/ceramic bonding substrate and method for producing same
- Publication number 20050072547
- Publication date Apr 7, 2005
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for producing metal/ceramic bonding circuit board
- Publication number 20050060887
- Publication date Mar 24, 2005
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20050047101
- Publication date Mar 3, 2005
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold and method for manufacturing metal-ceramic composite member
- Publication number 20050016707
- Publication date Jan 27, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY

Hideyo Osanai

Person

Patents Grantslast 30 patents

Metal/ceramic bonding substrate and method for producing same

Method for producing heat radiation member

Heat radiating plate and method for producing same

Heat radiating plate with supporting members and protrusion members

Electronic part mounting substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Method of attaching an electronic part to a copper plate having a s...

Metal/ceramic bonding substrate and method for producing same

Manufacturing method of radiator-integrated substrate and radiator-...

Liquid-cooled integrated substrate and manufacturing method of liqu...

Fin-integrated substrate and manufacturing method of fin-integrated...

Aluminum bonding member and method for producing same

Electronic part mounting substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Method of manufacturing a metal-ceramic circuit board

Aluminum/ceramic bonding substrate and method for producing same

Power module member manufactured by wet treatment, and wet treatmen...

Circuit board and a power module employing the same

Metal-ceramic circuit board

Method for producing metal/ceramic bonding circuit board

Aluminum/ceramic bonding substrate

Insulating substrate boards for semiconductor and power modules

Aluminum/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Electronic part mounting substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Metal/ceramic bonding substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Circuit board, process for producing the same and a power module em...

Patents Applicationslast 30 patents

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

HEAT RADIATION MEMBER AND METHOD FOR PRODUCING SAME

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

MANUFACTURING METHOD OF RADIATOR-INTEGRATED SUBSTRATE AND RADIATOR-...

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQU...

FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED...

ALUMINUM BONDING MEMBER AND METHOD FOR PRODUCING SAME

Power module member manufactured by wet treatment, and wet treatmen...

Electronic part mounting substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Method of manufacturing a metal-ceramic circuit board

Circuit board and a power module employing the same

Aluminum/ceramic bonding substrate

Aluminum bonding member and method for producing same

Method of manufacturing a metal-ceramic circuit board

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Method for producing metal/ceramic bonding circuit board

Electronic part mounting substrate and method for producing same

Mold and method for manufacturing metal-ceramic composite member