Hideyuki FUJIMOTO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method using same
- Patent number 12,048,964
- Issue date Jul 30, 2024
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver-bismuth powder, conductive paste and conductive film
- Patent number 10,458,004
- Issue date Oct 29, 2019
- Dowa Electronics Materials Co., Ltd.
- Kozo Ogi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDED PRODUCT USING SAME
- Publication number 20200035637
- Publication date Jan 30, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Tatsuro Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20190283129
- Publication date Sep 19, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Silver-Bismuth Powder,Conductive Paste and Conductive Film
- Publication number 20160040271
- Publication date Feb 11, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Kozo OGI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...