Hideyuki Fukasawa

Person

Hadano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,705,505
- Issue date Mar 16, 2004
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,533,162
- Issue date Mar 18, 2003
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and multi-pin connector therefor
- Patent number 6,213,786
- Issue date Apr 10, 2001
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,193,144
- Issue date Feb 27, 2001
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-pin connector
- Patent number 6,132,221
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multi-pin connector
- Patent number 5,743,009
- Issue date Apr 28, 1998
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive bumps
- Patent number 5,551,148
- Issue date Sep 3, 1996
- Hitachi, Ltd.
- Shinichi Kazui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minute particle loading method and apparatus
- Patent number 5,279,045
- Issue date Jan 18, 1994
- Hitachi, Ltd.
- Hitoshi Odashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for aligning solder balls
- Patent number 4,871,110
- Issue date Oct 3, 1989
- Hitachi, Ltd.
- Hideyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20030057264
- Publication date Mar 27, 2003
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20010000906
- Publication date May 10, 2001
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hideyuki Fukasawa

Person

Patents Grantslast 30 patents

Paste providing method, soldering method and apparatus and system t...

Paste providing method, soldering method and apparatus and system t...

Electronic device and multi-pin connector therefor

Paste providing method, soldering method and apparatus and system t...

Multi-pin connector

Method of making multi-pin connector

Method for forming conductive bumps

Minute particle loading method and apparatus

Method and apparatus for aligning solder balls

Patents Applicationslast 30 patents

Paste providing method, soldering method and apparatus and system t...

Paste providing method, soldering method and apparatus and system t...