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Hideyuki Fukushima

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  • Koshi City, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING APPARATUS AND BONDING METHOD
    • Publication number 20240096846
    • Publication date Mar 21, 2024
    • TOKYO ELECTRON LIMITED
    • Hideyuki Fukushima
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    BONDING APPARATUS AND BONDING METHOD
    • Publication number 20230162982
    • Publication date May 25, 2023
    • TOKYO ELECTRON LIMITED
    • Hideyuki Fukushima
    • H01 - BASIC ELECTRIC ELEMENTS