Hideyuki Hara

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,916,455
- Issue date Feb 9, 2021
- Ebara Corporation
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,297,475
- Issue date May 21, 2019
- Ebara Corporation
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 8,734,661
- Issue date May 27, 2014
- Ebara Corporation
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Grant
Catalyst-aided chemical processing method and apparatus
- Patent number 7,651,625
- Issue date Jan 26, 2010
- Osaka University
- Kazuto Yamauchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FLATTENING METHOD AND FLATTENING APPARATUS
- Publication number 20190228994
- Publication date Jul 25, 2019
- EBARA CORPORATION
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENING METHOD AND FLATTENING APPARATUS
- Publication number 20140231011
- Publication date Aug 21, 2014
- EBARA CORPORATION
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYST-AIDED CHEMICAL PROCESSING METHOD AND APPARATUS
- Publication number 20100147463
- Publication date Jun 17, 2010
- Kazuto Yamauchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flattening method and flattening apparatus
- Publication number 20090095712
- Publication date Apr 16, 2009
- EBARA CORPORATION
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Application
Catalyst-aided chemical processing method and apparatus
- Publication number 20080073222
- Publication date Mar 27, 2008
- Kazuto Yamauchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR