Hideyuki MURAYAMA

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Seto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module structure
- Patent number 11,222,879
- Issue date Jan 11, 2022
- Denso Corporation
- Tomo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE STRUCTURE
- Publication number 20210028154
- Publication date Jan 28, 2021
- Toyota Jidosha Kabushiki Kaisha
- Tomo SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS