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Hideyuki Sando
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of preparing terminal board
Patent number
7,278,206
Issue date
Oct 9, 2007
Disco Corporation
Kazuhisa Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer dividing method
Patent number
6,676,491
Issue date
Jan 13, 2004
Disco Corporation
Kazuhisa Arai
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer cutting machine
Patent number
6,500,047
Issue date
Dec 31, 2002
Disco Corporation
Kazuhisa Arai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method of preparing terminal board
Publication number
20060288826
Publication date
Dec 28, 2006
Kazuhisa Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer dividing method
Publication number
20030013380
Publication date
Jan 16, 2003
Kazuhisa Arai
B24 - GRINDING POLISHING
Information
Patent Application
Semiconductor wafer cutting machine
Publication number
20010029938
Publication date
Oct 18, 2001
Kazuhisa Arai
B28 - WORKING CEMENT, CLAY, OR STONE