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Hideyuki Sandoh

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing wafer
    • Patent number 11,894,271
    • Issue date Feb 6, 2024
    • Disco Corporation
    • Karl Heinz Priewasser
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing method of wafer
    • Patent number 11,495,466
    • Issue date Nov 8, 2022
    • Disco Corporation
    • Hideyuki Sandoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,056,346
    • Issue date Jul 6, 2021
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,811,458
    • Issue date Oct 20, 2020
    • Disco Corporation
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,410,923
    • Issue date Sep 10, 2019
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing a wafer
    • Patent number 10,083,867
    • Issue date Sep 25, 2018
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip bonder
    • Patent number 7,222,772
    • Issue date May 29, 2007
    • Disco Corporation
    • Kazuhisa Arai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING CHIPS
    • Publication number 20230066651
    • Publication date Mar 2, 2023
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20220028742
    • Publication date Jan 27, 2022
    • Disco Corporation
    • Karl Heinz PRIEWASSER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20210104408
    • Publication date Apr 8, 2021
    • Disco Corporation
    • Hideyuki SANDOH
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210057225
    • Publication date Feb 25, 2021
    • Disco Corporation
    • Hideyuki SANDOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLASMA ETCHING APPARATUS
    • Publication number 20210043474
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20190109173
    • Publication date Apr 11, 2019
    • Disco Corporation
    • Ryugo OBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180330957
    • Publication date Nov 15, 2018
    • Disco Corporation
    • Frank Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE WAFER PROCESSING METHOD
    • Publication number 20180096892
    • Publication date Apr 5, 2018
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180076088
    • Publication date Mar 15, 2018
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING A WAFER
    • Publication number 20180068895
    • Publication date Mar 8, 2018
    • Disco Corporation
    • Hideyuki Sandoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip chip bonder
    • Publication number 20040206800
    • Publication date Oct 21, 2004
    • Kazuhisa Arai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Machine for processing electrodes formed on a plate-like workpiece
    • Publication number 20040208718
    • Publication date Oct 21, 2004
    • Kazuhisa Arai
    • B24 - GRINDING POLISHING