Hideyuki SEIKE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 9,818,736
- Issue date Nov 14, 2017
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure and semiconductor device
- Patent number 9,640,500
- Issue date May 2, 2017
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 9,257,402
- Issue date Feb 9, 2016
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 9,224,706
- Issue date Dec 29, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating and electronic component
- Patent number 9,177,687
- Issue date Nov 3, 2015
- TDK Corporation
- Kenichi Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal structure and semiconductor device
- Patent number 9,070,606
- Issue date Jun 30, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, and semiconductor element and module substrate...
- Patent number 8,970,037
- Issue date Mar 3, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating and electronic component
- Patent number 8,933,336
- Issue date Jan 13, 2015
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, printed circuit board, module board, electronic...
- Patent number 8,787,028
- Issue date Jul 22, 2014
- TDK Corporation
- Yuhei Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...
- Publication number 20140054770
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20140054767
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20140054768
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...
- Publication number 20140054769
- Publication date Feb 27, 2014
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD IN...
- Publication number 20130192873
- Publication date Aug 1, 2013
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC...
- Publication number 20130135834
- Publication date May 30, 2013
- TDK Corporation
- Yuhei Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20130130059
- Publication date May 23, 2013
- TDK Corporation
- Kenichi YOSHIDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COATING AND ELECTRONIC COMPONENT
- Publication number 20130126208
- Publication date May 23, 2013
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS

Hideyuki SEIKE

Person

Patents Grantslast 30 patents

Method for producing semiconductor chip

Method for producing semiconductor package

Method for producing semiconductor package

Terminal structure and semiconductor device

Terminal structure, and semiconductor element and module substrate...

Terminal structure, and semiconductor element and module substrate...

Coating and electronic component

Terminal structure and semiconductor device

Terminal structure, and semiconductor element and module substrate...

Coating and electronic component

Terminal structure, printed circuit board, module board, electronic...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...

TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE

TERMINAL STRUCTURE AND SEMICONDUCTOR DEVICE

TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE...

STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD IN...

TERMINAL STRUCTURE, PRINTED CIRCUIT BOARD, MODULE BOARD, ELECTRONIC...

COATING AND ELECTRONIC COMPONENT

COATING AND ELECTRONIC COMPONENT