Hideyuki Tomizawa

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Rensselaer, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a metal wiring with a metal cap
- Patent number 8,614,510
- Issue date Dec 24, 2013
- Kabushiki Kaisha Toshiba
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION OF UNDER-LAYER CONDUCTIVE PATHWAY
- Publication number 20140027914
- Publication date Jan 30, 2014
- Toshiba America Electronic Components, Inc
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADED DENSITY LAYER FOR FORMATION OF INTERCONNECT STRUCTURES
- Publication number 20130161798
- Publication date Jun 27, 2013
- Toshiba America Electronic Components, Inc
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110108987
- Publication date May 12, 2011
- Kabushiki Kaisha Toshiba
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100237501
- Publication date Sep 23, 2010
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS