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Hideyuki Wakabayashi
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
Patent number
8,043,514
Issue date
Oct 25, 2011
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
Patent number
7,347,949
Issue date
Mar 25, 2008
Shinko Electric Industries, Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
JIG FOR PRINTED SUBSTRATE INSPECTION AND PRINTED SUBSTRATE INSPECTI...
Publication number
20080218188
Publication date
Sep 11, 2008
Shinko Electric Industries Co., Ltd.
Koji ARAI
G01 - MEASURING TESTING
Information
Patent Application
Method of manufacturing a wiring board by utilizing electro plating
Publication number
20080116079
Publication date
May 22, 2008
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed wiring board and method for fabricating the same
Publication number
20070045847
Publication date
Mar 1, 2007
Shinko Electric Industries Co., Ltd.
Koji Arai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing a wiring board by utilizing electro plating
Publication number
20060016779
Publication date
Jan 26, 2006
Shinko Electric Industries Co., Ltd.
Hiroshi Miyagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR