Hideyuki Yoshino

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Ube-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder coated lid
- Patent number 7,182,240
- Issue date Feb 27, 2007
- Senju Metal Industry Co., Ltd.
- Hideyuki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid with variable solder layer for sealing semiconductor package, p...
- Patent number 5,821,455
- Issue date Oct 13, 1998
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Tetsuya Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solder coated lid
- Publication number 20040258948
- Publication date Dec 23, 2004
- Senju Metal Industry Co., Ltd.
- Hideyuki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder coated lid
- Publication number 20020121072
- Publication date Sep 5, 2002
- Hideyuki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS