Hien D. Nguyen

Follow

Person

The Colony, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional chip-to-wafer integration
- Patent number 10,032,749
- Issue date Jul 24, 2018
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for wafer-level processing of QFN packages
- Patent number 9,472,451
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package device having high-standoff peripheral solder b...
- Patent number 9,219,043
- Issue date Dec 22, 2015
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip-to-wafer integration
- Patent number 9,190,391
- Issue date Nov 17, 2015
- Maxim Integrated Products, Inc.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer-level processing of QFN packages
- Patent number 8,860,222
- Issue date Oct 14, 2014
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION
- Publication number 20160071826
- Publication date Mar 10, 2016
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20150028475
- Publication date Jan 29, 2015
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...
- Publication number 20140264845
- Publication date Sep 18, 2014
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20130161817
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION
- Publication number 20130105966
- Publication date May 2, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS