Hiep M. Le

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Press-fit semiconductor package
- Patent number 6,160,309
- Issue date Dec 12, 2000
- Hiep Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of passivating a semiconductor substrate
- Patent number 5,908,316
- Issue date Jun 1, 1999
- Motorola, Inc.
- Hiep M. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diode device with non-planar heatsink and method of m...
- Patent number 5,751,061
- Issue date May 12, 1998
- Motorola, Inc.
- Lonne L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectifier and method
- Patent number 5,005,069
- Issue date Apr 2, 1991
- Motorola Inc.
- William D. Wasmer
- H01 - BASIC ELECTRIC ELEMENTS