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Hiep X. Nguyen
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West Covina, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Adhesion promotion in printed circuit boards
Patent number
9,040,117
Issue date
May 26, 2015
Enthone Inc.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Adhesion promotion in printed circuit boards
Patent number
8,142,840
Issue date
Mar 27, 2012
Enthone Inc.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Adhesion promotion in printed circuit boards
Patent number
7,682,432
Issue date
Mar 23, 2010
Enthone Inc.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Adhesion promotion in printed circuit boards
Patent number
7,232,478
Issue date
Jun 19, 2007
Enthone Inc.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
Publication number
20130078367
Publication date
Mar 28, 2013
Enthone Inc.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
Publication number
20070228333
Publication date
Oct 4, 2007
ENTHONE, INC.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
Publication number
20070227625
Publication date
Oct 4, 2007
ENTHONE, INC.
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Adhesion promotion in printed circuit boards
Publication number
20050011400
Publication date
Jan 20, 2005
Abayomi I. Owei
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...