Hiep X. Nguyen

Person

  • West Covina, CA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

    • Publication number 20130078367
    • Publication date Mar 28, 2013
    • Enthone Inc.
    • Abayomi I. Owei
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

    • Publication number 20070228333
    • Publication date Oct 4, 2007
    • ENTHONE, INC.
    • Abayomi I. Owei
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

    • Publication number 20070227625
    • Publication date Oct 4, 2007
    • ENTHONE, INC.
    • Abayomi I. Owei
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Adhesion promotion in printed circuit boards

    • Publication number 20050011400
    • Publication date Jan 20, 2005
    • Abayomi I. Owei
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...