Hiep Xuan Nguyen

Person

Grand Prairie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with enhanced heat dissipation
- Patent number 11,404,360
- Issue date Aug 2, 2022
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,362,047
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package mold assembly
- Patent number 10,573,537
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package mold assembly
- Patent number 10,186,431
- Issue date Jan 22, 2019
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,496,198
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency counter-flow shelf cooling system
- Patent number 7,016,193
- Issue date Mar 21, 2006
- Cisco Technology, Inc.
- Joseph Jacques
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Airflow system
- Patent number 6,594,148
- Issue date Jul 15, 2003
- Cisco Technology, Inc.
- Hiep X. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE
- Publication number 20220319950
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20220285293
- Publication date Sep 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH ENHANCED HEAT DISSIPATION
- Publication number 20220208662
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Zhemin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY
- Publication number 20220122936
- Publication date Apr 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory WILLIAMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20210327829
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
- Publication number 20190157110
- Publication date May 23, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
- Publication number 20180190509
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
- Publication number 20170103904
- Publication date Apr 13, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
- Publication number 20160322277
- Publication date Nov 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
- Publication number 20160093552
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS

Hiep Xuan Nguyen

Person

Patents Grantslast 30 patents

Embedded lid for low cost and improved thermal performance

Integrated system-in-package with radiation shielding

Power module with enhanced heat dissipation

Integrated system-in-package with radiation shielding

Integrated circuit package mold assembly

Integrated circuit package mold assembly

Integration of backside heat spreader for thermal management

Integration of backside heat spreader for thermal management

High efficiency counter-flow shelf cooling system

Airflow system

Patents Applicationslast 30 patents

EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

POWER MODULE WITH ENHANCED HEAT DISSIPATION

ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY

INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY

INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY

INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT

INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT