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Hikaru NOMURA

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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder alloy, solder paste, solder ball, resin flux-cored solder an...
    • Patent number 11,241,760
    • Issue date Feb 8, 2022
    • Senju Metal Industry Co., Ltd.
    • Takahiro Yokoyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder ball, solder preform, solder paste and solder...
    • Patent number 11,167,379
    • Issue date Nov 9, 2021
    • Senju Metal Industry Co., Ltd.
    • Yuki Iijima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder ball, and solder joint
    • Patent number 10,500,680
    • Issue date Dec 10, 2019
    • Senju Metal Industry Co., Ltd.
    • Ken Tachibana
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,343,238
    • Issue date Jul 9, 2019
    • Senju Metal Industry Co., Ltd.
    • Masayuki Suzuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 10,213,879
    • Issue date Feb 26, 2019
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,076,808
    • Issue date Sep 18, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board and printed circuit board
    • Patent number 9,907,155
    • Issue date Feb 27, 2018
    • Canon Kabushiki Kaisha
    • Takashi Numagi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 9,808,890
    • Issue date Nov 7, 2017
    • Senju Metal Industry Co., Ltd.
    • Hikaru Nomura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,780,055
    • Issue date Oct 3, 2017
    • Senju Metal Industry Co., Ltd.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20240363571
    • Publication date Oct 31, 2024
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...
    • Publication number 20210001431
    • Publication date Jan 7, 2021
    • SENJU METAL INDUSTRY CO., LTD
    • Takahiro YOKOYAMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...
    • Publication number 20200376608
    • Publication date Dec 3, 2020
    • SENJU METAL INDUSTRY CO., LTD.
    • Takahiro YOKOYAMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE AND SOLDER...
    • Publication number 20200306895
    • Publication date Oct 1, 2020
    • SENJU METAL INDUSTRY CO., LTD.
    • Yuki IIJIMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    "Lead-Free Solder Ball"
    • Publication number 20190088611
    • Publication date Mar 21, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20190076966
    • Publication date Mar 14, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT
    • Publication number 20180361519
    • Publication date Dec 20, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken TACHIBANA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20180005970
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20180001426
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SOLDER ALLOY
    • Publication number 20170151636
    • Publication date Jun 1, 2017
    • SENJU METAL INDUSTRY CO., LTD.
    • Shunsaku YOSHIKAWA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20160074971
    • Publication date Mar 17, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken Tachibana
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20150328722
    • Publication date Nov 19, 2015
    • SENJU METAL INDUSTRY CO., LTD
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD
    • Publication number 20150319845
    • Publication date Nov 5, 2015
    • Canon Kabushiki Kaisha
    • Takashi Numagi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20150221606
    • Publication date Aug 6, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Solder Alloy
    • Publication number 20150086263
    • Publication date Mar 26, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Hikaru Nomura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037087
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken Tachibana
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037088
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR