Hikaru Okubo

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,853,312
- Issue date Oct 7, 2014
- Sumitomo Bakelite Co., Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,614,270
- Issue date Dec 24, 2013
- Sumitomo Bakelite Company, Ltd.
- Hikaru Okubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid resin composition, semiconductor wafer having adhesive layer...
- Patent number 8,217,115
- Issue date Jul 10, 2012
- Sumitomo Bakelite Company, Ltd.
- Takeshi Masuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,088,308
- Issue date Jan 3, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Die-attaching paste and semiconductor device
- Patent number 6,861,013
- Issue date Mar 1, 2005
- Sumitomo Bakelite Company, Ltd.
- Nobuki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20130109798
- Publication date May 2, 2013
- SUMITOMO BAKELITE CO., LTD.
- Hikaru OKUBO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20120068106
- Publication date Mar 22, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru OKUBO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER...
- Publication number 20100006998
- Publication date Jan 14, 2010
- Takeshi Masuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin Composition and Semiconductor Device Produced By Using the Same
- Publication number 20070213467
- Publication date Sep 13, 2007
- Hikaru Okubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Die-attaching paste and semiconductor device
- Publication number 20030146521
- Publication date Aug 7, 2003
- Nobuki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...