Hilario L. Oh

Person

Rochester Hills, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Recipe cascading in a wafer processing system
- Patent number 7,052,919
- Issue date May 30, 2006
- ASML Holding N.V.
- Hilario Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Apparatus and method for chemical mechanical polishing of substrates
- Patent number 7,029,381
- Issue date Apr 18, 2006
- Aviza Technology, Inc.
- Jason Melvin
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chemical mechanical polishing of substrates
- Patent number 6,984,168
- Issue date Jan 10, 2006
- Aviza Technology, Inc.
- Jason Melvin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Robot pre-positioning in a wafer processing system
- Patent number 6,952,622
- Issue date Oct 4, 2005
- ASML Holding N.V.
- Dikran Babikian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Robot pre-positioning in a wafer processing system
- Patent number 6,865,437
- Issue date Mar 8, 2005
- ASML Holdings N.V.
- Dikran Babikian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
In-situ method and apparatus for end point detection in chemical me...
- Patent number 6,798,529
- Issue date Sep 28, 2004
- Aviza Technology, Inc.
- Nannaji Saka
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for resolving conflicts in a substrate process...
- Patent number 6,768,930
- Issue date Jul 27, 2004
- ASML Holding N.V.
- Hilario Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for resolving conflicts in a substrate process...
- Patent number 6,694,218
- Issue date Feb 17, 2004
- ASML Holdings N.V.
- Hilario Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Recipe cascading in a wafer processing system
- Patent number 6,678,572
- Issue date Jan 13, 2004
- ASML Holdings, N.V.
- Hilario Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Chemical mechanical polishing of copper-oxide damascene structures
- Patent number 6,667,239
- Issue date Dec 23, 2003
- ASML US, Inc.
- Nanaji Saka
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ method and apparatus for end point detection in chemical me...
- Patent number 6,476,921
- Issue date Nov 5, 2002
- ASML US, Inc.
- Nannaji Saka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chemical mechanical polishing
- Patent number 6,458,013
- Issue date Oct 1, 2002
- ASML US, Inc.
- Nannaji Saka
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for resolving conflicts in a substrate process...
- Patent number 6,418,356
- Issue date Jul 9, 2002
- Silicon Valley Group, Inc.
- Hilario Oh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Recipe cascading in a wafer processing system
- Publication number 20040087187
- Publication date May 6, 2004
- Hilario Oh
- G05 - CONTROLLING REGULATING
Information Patent Application
Robot pre-positioning in a wafer processing system
- Publication number 20040078109
- Publication date Apr 22, 2004
- Dikran Babikian
- G05 - CONTROLLING REGULATING
Information Patent Application
Method and apparatus for resolving conflicts in a substrate process...
- Publication number 20030154001
- Publication date Aug 14, 2003
- Hilario Oh
- G05 - CONTROLLING REGULATING
Information Patent Application
Chemical mechanical polishing of copper-oxide damascene structures
- Publication number 20030082904
- Publication date May 1, 2003
- ASML US, Inc.
- Nanaji Saka
- B24 - GRINDING POLISHING
Information Patent Application
In-situ method and apparatus for end point detection in chemical me...
- Publication number 20030045100
- Publication date Mar 6, 2003
- Massachusetts Institute of Technology
- Nanaji Saka
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for resolving conflicts in a substrate process...
- Publication number 20030028282
- Publication date Feb 6, 2003
- HILARIO OH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus and method for chemical mechanical polishing of substrates
- Publication number 20020137448
- Publication date Sep 26, 2002
- Nam P. Suh
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR RESOLVING CONFLICTS IN A SUBSTRATE PROCESS...
- Publication number 20020059015
- Publication date May 16, 2002
- HILARIO OH
- G06 - COMPUTING CALCULATING COUNTING

Hilario L. Oh

Person

Patents Grantslast 30 patents

Recipe cascading in a wafer processing system

Apparatus and method for chemical mechanical polishing of substrates

Apparatus and method for chemical mechanical polishing of substrates

Robot pre-positioning in a wafer processing system

Robot pre-positioning in a wafer processing system

In-situ method and apparatus for end point detection in chemical me...

Method and apparatus for resolving conflicts in a substrate process...

Method and apparatus for resolving conflicts in a substrate process...

Recipe cascading in a wafer processing system

Chemical mechanical polishing of copper-oxide damascene structures

In-situ method and apparatus for end point detection in chemical me...

Method of chemical mechanical polishing

Method and apparatus for resolving conflicts in a substrate process...

Patents Applicationslast 30 patents

Recipe cascading in a wafer processing system

Robot pre-positioning in a wafer processing system

Method and apparatus for resolving conflicts in a substrate process...

Chemical mechanical polishing of copper-oxide damascene structures

In-situ method and apparatus for end point detection in chemical me...

Method and apparatus for resolving conflicts in a substrate process...

Apparatus and method for chemical mechanical polishing of substrates

METHOD AND APPARATUS FOR RESOLVING CONFLICTS IN A SUBSTRATE PROCESS...