Himani Suhag Kamineni

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Mechanicville, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit product having a through-substrate-via (TSV) and...
- Patent number 10,446,443
- Issue date Oct 15, 2019
- GLOBALFOUNDRIES Inc.
- Himani Suhag Kamineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a through-substrate-via (TSV) and a metallizatio...
- Patent number 9,917,009
- Issue date Mar 13, 2018
- GLOBALFOUNDRIES Inc.
- Himani Suhag Kamineni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD TO REMOVE SEMICONDUCTOR CHIP MATERIAL FOR OPTI...
- Publication number 20230418011
- Publication date Dec 28, 2023
- Psiquantum, Corp.
- George A. KOVALL
- G02 - OPTICS
Information Patent Application
INTEGRATED CIURCUIT PRODUCT HAVING A THROUGH-SUBSTRATE-VIA (TSV) AN...
- Publication number 20180158733
- Publication date Jun 7, 2018
- GLOBALFOUNDRIES INC.
- Himani Suhag Kamineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A THROUGH-SUBSTRATE-VIA (TSV) AND A METALLIZATIO...
- Publication number 20180040511
- Publication date Feb 8, 2018
- GLOBALFOUNDRIES INC.
- Himani Suhag Kamineni
- H01 - BASIC ELECTRIC ELEMENTS