Himendra JHA

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytically depositing a copper...
- Patent number 12,054,843
- Issue date Aug 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Ralf Schmidt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 11,035,051
- Issue date Jun 15, 2021
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER...
- Publication number 20230142446
- Publication date May 11, 2023
- Atotech Deutschland GmbH & Co. KG
- Ralf SCHMIDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20210262105
- Publication date Aug 26, 2021
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20190203369
- Publication date Jul 4, 2019
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR