Hin Hwa Goh

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 10,790,158
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
- Patent number 10,297,556
- Issue date May 21, 2019
- STATS ChipPAC Pte. Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 10,177,010
- Issue date Jan 8, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
- Patent number 10,163,747
- Issue date Dec 25, 2018
- STATS ChipPAC Pte. Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,666,500
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
- Patent number 9,607,965
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 9,449,943
- Issue date Sep 20, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a substrate embedded dummy...
- Patent number 9,236,278
- Issue date Jan 12, 2016
- Stats Chippac Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming FO-WLCSP with multiple e...
- Patent number 9,142,428
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,087,930
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making TSV interconnect structur...
- Patent number 9,054,083
- Issue date Jun 9, 2015
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of laser-marking laminate layer for...
- Patent number 8,916,416
- Issue date Dec 23, 2014
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,766,426
- Issue date Jul 1, 2014
- Stats Chippac Ltd.
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,759,155
- Issue date Jun 24, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interconnect structure with TSV usin...
- Patent number 8,659,162
- Issue date Feb 25, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming FO-WLCSP with multiple e...
- Patent number 8,648,470
- Issue date Feb 11, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation connector an...
- Patent number 8,624,364
- Issue date Jan 7, 2014
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,456,002
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,455,991
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with active surface heat remova...
- Patent number 8,421,212
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
- Patent number 8,405,230
- Issue date Mar 26, 2013
- Stats Chippac Ltd.
- Jae Soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing common voltage bus and...
- Patent number 8,309,451
- Issue date Nov 13, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,304,880
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 8,067,308
- Issue date Nov 29, 2011
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
- Patent number 7,880,313
- Issue date Feb 1, 2011
- ChipPAC, Inc.
- Jae Soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of placing semiconductor die on a t...
- Patent number 7,666,709
- Issue date Feb 23, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe flipchip package system
- Patent number 7,414,318
- Issue date Aug 19, 2008
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe flipchip package system
- Patent number 7,250,685
- Issue date Jul 31, 2007
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making a Fan-Out Semiconductor P...
- Publication number 20240379479
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
- Publication number 20240096807
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid Substrate with Un...
- Publication number 20240071885
- Publication date Feb 29, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
- Publication number 20190109015
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Warpage in Reconstit...
- Publication number 20170194228
- Publication date Jul 6, 2017
- STATS ChipPAC Pte Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Warpage in Reconstit...
- Publication number 20170133330
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
- Publication number 20160351419
- Publication date Dec 1, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20150228552
- Publication date Aug 13, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
- Publication number 20150115465
- Publication date Apr 30, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Warpage in Reconstit...
- Publication number 20150084213
- Publication date Mar 26, 2015
- STATS ChipPAC, Ltd.
- Kian Meng Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20140110861
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP with Multiple E...
- Publication number 20140077381
- Publication date Mar 20, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Laser-Marking Laminate Layer For...
- Publication number 20130127039
- Publication date May 23, 2013
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...
- Publication number 20130113092
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY...
- Publication number 20130075922
- Publication date Mar 28, 2013
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Common Voltage Bus and...
- Publication number 20120261817
- Publication date Oct 18, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP with Multiple E...
- Publication number 20120187568
- Publication date Jul 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20120112340
- Publication date May 10, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074588
- Publication date Mar 29, 2012
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074560
- Publication date Mar 29, 2012
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...
- Publication number 20120068328
- Publication date Mar 22, 2012
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20120061854
- Publication date Mar 15, 2012
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20120013004
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110210436
- Publication date Sep 1, 2011
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...
- Publication number 20110108970
- Publication date May 12, 2011
- Jae Soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Laser-Marking Laminate Layer For...
- Publication number 20110012258
- Publication date Jan 20, 2011
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100308443
- Publication date Dec 9, 2010
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS

Hin Hwa Goh

Person

Patents Grantslast 30 patents

Semiconductor device and method of balancing surfaces of an embedde...

Semiconductor device and method of controlling warpage in reconstit...

Semiconductor device and method of balancing surfaces of an embedde...

Semiconductor device and method of controlling warpage in reconstit...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of controlling warpage in reconstit...

Semiconductor device and method of balancing surfaces of an embedde...

Integrated circuit packaging system with a substrate embedded dummy...

Semiconductor device and method of forming FO-WLCSP with multiple e...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of making TSV interconnect structur...

Semiconductor device and method of laser-marking laminate layer for...

Integrated circuit packaging system with warpage control and method...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device having an interconnect structure with TSV usin...

Semiconductor device and method of forming FO-WLCSP with multiple e...

Integrated circuit packaging system with encapsulation connector an...

Semiconductor device and method of forming insulating layer dispose...

Integrated circuit packaging system with warpage control and method...

Integrated circuit packaging system with active surface heat remova...

Semiconductor flip chip package having substantially non-collapsibl...

Semiconductor device and method of providing common voltage bus and...

Integrated circuit packaging system with package-on-package and met...

Semiconductor device and method of forming an interconnect structur...

Semiconductor flip chip package having substantially non-collapsibl...

Semiconductor device and method of placing semiconductor die on a t...

Etched leadframe flipchip package system

Etched leadframe flipchip package system

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Fan-Out Semiconductor P...

Semiconductor Device and Method of Stacking Hybrid Substrates with...

Semiconductor Device and Method of Stacking Hybrid Substrates

Semiconductor Device and Method of Forming Hybrid Substrate with Un...

Semiconductor Device and Method of Balancing Surfaces of an Embedde...

Semiconductor Device and Method of Controlling Warpage in Reconstit...

Semiconductor Device and Method of Controlling Warpage in Reconstit...

Semiconductor Device and Method of Balancing Surfaces of an Embedde...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Balancing Surfaces of an Embedde...

Semiconductor Device and Method of Controlling Warpage in Reconstit...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Semiconductor Device and Method of Forming FO-WLCSP with Multiple E...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Laser-Marking Laminate Layer For...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY...

Semiconductor Device and Method of Providing Common Voltage Bus and...

Semiconductor Device and Method of Forming FO-WLCSP with Multiple E...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...

Semiconductor Device Having an Interconnect Structure with TSV Usin...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...

Semiconductor Device and Method of Laser-Marking Laminate Layer For...

Semiconductor Device and Method of Forming an Interconnect Structur...