Hinata HAYASHI

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Shizuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Connector with built-in substrate and method of manufacturing chain...
- Patent number 11,600,940
- Issue date Mar 7, 2023
- Yazaki Corporation
- Ryota Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate protection structure during inner housing assembling
- Patent number 11,502,457
- Issue date Nov 15, 2022
- Yazaki Corporation
- Ryota Ando
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR WITH BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING CHAIN...
- Publication number 20220059961
- Publication date Feb 24, 2022
- YAZAKI CORPORATION
- Ryota ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER DETACHMENT PREVENTION STRUCTURE
- Publication number 20220059964
- Publication date Feb 24, 2022
- YAZAKI CORPORATION
- Ryota ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROTECTION STRUCTURE DURING INNER HOUSING ASSEMBLING
- Publication number 20220059969
- Publication date Feb 24, 2022
- YAZAKI CORPORATION
- Ryota ANDO
- H01 - BASIC ELECTRIC ELEMENTS