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Hing Leung Marchy Li
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Kwai Chung, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Force sensor in an ultrasonic wire bonding device
Patent number
11,798,911
Issue date
Oct 24, 2023
ASMPT SINGAPORE PTE. LTD.
Hing Leung Li
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Information
Patent Grant
Flip chip bonding tool
Patent number
7,458,495
Issue date
Dec 2, 2008
ASM Assembly Automation LTD
Ran Fu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ULTRASONIC TRANSDUCER OPERABLE AT MULTIPLE RESONANT FREQUENCIES
Publication number
20240116126
Publication date
Apr 11, 2024
ASMPT SINGAPORE PTE. LTD
Tsz Kit YU
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Information
Patent Application
ULTRASONIC TRANSDUCER OPERABLE AT MULTIPLE RESONANT FREQUENCIES
Publication number
20240116127
Publication date
Apr 11, 2024
ASMPT SINGAPORE PTE. LTD
Tsz Kit YU
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Information
Patent Application
FORCE SENSOR IN AN ULTRASONIC WIRE BONDING DEVICE
Publication number
20230343741
Publication date
Oct 26, 2023
ASMPT SINGAPORE PTE. LTD
Hing Leung LI
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Information
Patent Application
Flip chip bonding tool
Publication number
20060076391
Publication date
Apr 13, 2006
ASM Assembly Automation Ltd.
Ran Fu
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Information
Patent Application
Ultrasonic transducer assembly
Publication number
20040245893
Publication date
Dec 9, 2004
ASM Assembly Automation Ltd
Hing Leung Marchy Li
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