TREA

Hing Suen Siu

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  • Hong Kong, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip chip bonding tool
    • Patent number 7,458,495
    • Issue date Dec 2, 2008
    • ASM Assembly Automation LTD
    • Ran Fu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Flip chip bonding tool
    • Publication number 20060076391
    • Publication date Apr 13, 2006
    • ASM Assembly Automation Ltd.
    • Ran Fu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR