Hiroaki Arai

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Kariya-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with cooling mechanism and production method t...
- Patent number 8,946,889
- Issue date Feb 3, 2015
- Denso Corporation
- Chikage Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor insulation structure
- Patent number 7,508,067
- Issue date Mar 24, 2009
- Denso Corporation
- Hiroaki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module mounting structure, a cardlike semiconductor m...
- Patent number 7,242,582
- Issue date Jul 10, 2007
- Denso Corporation
- Tsuyoshi Kurauchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD T...
- Publication number 20140091452
- Publication date Apr 3, 2014
- DENSO CORPORATION
- Chikage Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD T...
- Publication number 20110316143
- Publication date Dec 29, 2011
- DENSO CORPORATION
- Chikage NORITAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor insulation structure
- Publication number 20070085197
- Publication date Apr 19, 2007
- DENSO CORPORATION
- Hiroaki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module mounting structure, a cardlike semiconductor m...
- Publication number 20050230816
- Publication date Oct 20, 2005
- DENSO CORPORATION
- Tsuyoshi Kurauchi
- H01 - BASIC ELECTRIC ELEMENTS