Hiroaki Ashizawa

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Ebina-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for perforating printed circuit board
- Patent number 8,278,594
- Issue date Oct 2, 2012
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser perforating printed circuit board
- Patent number 7,531,767
- Issue date May 12, 2009
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining apparatus
- Patent number 7,205,501
- Issue date Apr 17, 2007
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20090166340
- Publication date Jul 2, 2009
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20060211158
- Publication date Sep 21, 2006
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining method and laser machining apparatus
- Publication number 20050155958
- Publication date Jul 21, 2005
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR