Hiroaki Date

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus
- Patent number 7,978,470
- Issue date Jul 12, 2011
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for producing multilayer board
- Patent number 7,943,001
- Issue date May 17, 2011
- Fujitsu Limited
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer sheet, heat transfer structural body and manufacturin...
- Patent number 7,610,678
- Issue date Nov 3, 2009
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-absorbing member, cooling device, and electronic apparatus
- Patent number 7,551,435
- Issue date Jun 23, 2009
- Fujitsu Limited
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus
- Patent number 7,502,227
- Issue date Mar 10, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling structure for electronic equipment
- Patent number 7,155,914
- Issue date Jan 2, 2007
- Fujitsu Limited
- Minoru Ishinabe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adhesive composition
- Patent number 6,790,881
- Issue date Sep 14, 2004
- Fujitsu Limited
- Hiroaki Date
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microcapsulating conductive metal particles with polymerized monomers
- Patent number 6,737,108
- Issue date May 18, 2004
- Fujitsu Limited
- Hiroaki Date
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive, bonding method and assembly of mounting substrate
- Patent number 6,576,081
- Issue date Jun 10, 2003
- Fujitsu Limited
- Hiroaki Date
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcapsulating conductive metal particles with polymerized monomers
- Patent number 6,406,746
- Issue date Jun 18, 2002
- Fujitsu Limited
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of microcapsule type conductive filler
- Patent number 6,080,443
- Issue date Jun 27, 2000
- Fujitsu Limited
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20090052135
- Publication date Feb 26, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Magnetic recording medium and manufacturing method for the same
- Publication number 20080220290
- Publication date Sep 11, 2008
- Fujitsu Limited
- Ken-ichi Itoh
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND DECOMPOSING METHOD OF ELECTRONIC DEVICE
- Publication number 20080145646
- Publication date Jun 19, 2008
- Fujitsu Limited
- Katsuji EBISU
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
Heat-absorbing member, cooling device, and electronic apparatus
- Publication number 20080055860
- Publication date Mar 6, 2008
- FUJITSU LIMITED
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Process for producing multilayer board
- Publication number 20070289706
- Publication date Dec 20, 2007
- FUJITSU LIMITED
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET AND ADHESIVE AGENT
- Publication number 20070224380
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Katsuji EBISU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat exchanger for liquid cooling
- Publication number 20070000655
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic apparatus
- Publication number 20060133032
- Publication date Jun 22, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Radiating fin and method for manufacturing the same
- Publication number 20060065970
- Publication date Mar 30, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic apparatus
- Publication number 20060038285
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat transfer sheet, heat transfer structural body and manufacturin...
- Publication number 20060037741
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling structure for electronic equipment
- Publication number 20060005549
- Publication date Jan 12, 2006
- FUJITSU LIMITED
- Minoru Ishinabe
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Adhesive composition
- Publication number 20030069333
- Publication date Apr 10, 2003
- FUJITSU LIMITED
- Hiroaki Date
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for production of microcapsule type conductive filler
- Publication number 20020197399
- Publication date Dec 26, 2002
- FUJITSU LIMITED
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE
- Publication number 20020084019
- Publication date Jul 4, 2002
- HIROAKI DATE
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki Date

Person

Patents Grantslast 30 patents

Electronic apparatus

Process for producing multilayer board

Heat transfer sheet, heat transfer structural body and manufacturin...

Heat-absorbing member, cooling device, and electronic apparatus

Electronic apparatus

Cooling structure for electronic equipment

Adhesive composition

Microcapsulating conductive metal particles with polymerized monomers

Adhesive, bonding method and assembly of mounting substrate

Microcapsulating conductive metal particles with polymerized monomers

Method for production of microcapsule type conductive filler

Patents Applicationslast 30 patents

SOLDER PASTE AND ELECTRONIC PART

ELECTRONIC APPARATUS

Magnetic recording medium and manufacturing method for the same

ELECTRONIC DEVICE AND DECOMPOSING METHOD OF ELECTRONIC DEVICE

Heat-absorbing member, cooling device, and electronic apparatus

Process for producing multilayer board

ADHESIVE SHEET AND ADHESIVE AGENT

Heat exchanger for liquid cooling

Electronic apparatus

Radiating fin and method for manufacturing the same

Electronic apparatus

Heat transfer sheet, heat transfer structural body and manufacturin...

Cooling structure for electronic equipment

Adhesive composition

Method for production of microcapsule type conductive filler

ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE