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Hiroaki KADOURA
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Seto-shi, JP
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last 30 patents
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Patent Grant
Method for evaluating solder joint portion
Patent number
7,658,538
Issue date
Feb 9, 2010
Aisin Seiki Kabushiki Kaisha
Hirofumi Koike
G01 - MEASURING TESTING
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last 30 patents
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Patent Application
METHOD FOR EVALUATING SOLDER JOINT PORTION
Publication number
20080240201
Publication date
Oct 2, 2008
AISIN SEIKI KABUSHIKI KAISHA
Hirofumi KOIKE
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...