Hiroaki Kishi

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,264,313
- Issue date Mar 1, 2022
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,840,166
- Issue date Nov 17, 2020
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,485
- Issue date Nov 26, 2019
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,347,551
- Issue date Jul 9, 2019
- Kabushiki Kaisha Toshiba
- Hiroaki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,204,891
- Issue date Feb 12, 2019
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,026,677
- Issue date Jul 17, 2018
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,984
- Issue date Apr 25, 2017
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of film carrier tape, manufacturing apparatus...
- Patent number 5,975,178
- Issue date Nov 2, 1999
- Kabushiki Kaisha Toshiba
- Masashi Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor integrated circuit having a dummy lead and shaped inn...
- Patent number 5,162,894
- Issue date Nov 10, 1992
- Kabushiki Kaisha Toshiba
- Masamichi Asano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, DIE ATTACH FILM, AND METHOD FOR MANUFACTURIN...
- Publication number 20200303249
- Publication date Sep 24, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200083150
- Publication date Mar 12, 2020
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295923
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180331019
- Publication date Nov 15, 2018
- Kabushiki Kaisha Toshiba
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180076107
- Publication date Mar 15, 2018
- Kabushiki Kaisha Toshiba
- Hiroaki KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170250124
- Publication date Aug 31, 2017
- Kabushiki Kaisha Toshiba
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170186738
- Publication date Jun 29, 2017
- KABUSHIKI KAISHA TOSHIBA
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20160351464
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Hiroaki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20160268240
- Publication date Sep 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki Kishi

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing same

Semiconductor device

Semiconductor device

Semiconductor package

Semiconductor module

Semiconductor device

Semiconductor module

Manufacturing method of film carrier tape, manufacturing apparatus...

Semiconductor integrated circuit having a dummy lead and shaped inn...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, DIE ATTACH FILM, AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR MODULE