Hiroaki Kurihara

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 7,932,470
- Issue date Apr 26, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible wiring substrate and method for producing the same
- Patent number 7,830,667
- Issue date Nov 9, 2010
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible wiring base material and process for producing the same
- Patent number 7,425,683
- Issue date Sep 16, 2008
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit boards
- Patent number 6,322,904
- Issue date Nov 27, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Dobashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Printed Wiring Board, Process For Producing the Same and Semiconduc...
- Publication number 20080236872
- Publication date Oct 2, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tatsuo Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20080174975
- Publication date Jul 24, 2008
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki KURIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film Carrier Tape for Mounting Electronic Components and Method of...
- Publication number 20080063838
- Publication date Mar 13, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board
- Publication number 20080053691
- Publication date Mar 6, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor device excellent in folding endurance
- Publication number 20080006441
- Publication date Jan 10, 2008
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible copper clad laminate, flexible printed wiring board obtain...
- Publication number 20070098910
- Publication date May 3, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Two-layer flexible printed wiring board and method for manufacturin...
- Publication number 20070090086
- Publication date Apr 26, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- B32 - LAYERED PRODUCTS

Hiroaki Kurihara

Person

Patents Grantslast 30 patents

Printed wiring board

Flexible wiring substrate and method for producing the same

Flexible wiring base material and process for producing the same

Copper foil for printed circuit boards

Patents Applicationslast 30 patents

Printed Wiring Board, Process For Producing the Same and Semiconduc...

FLEXIBLE WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Film Carrier Tape for Mounting Electronic Components and Method of...

Printed Wiring Board

Wiring board and semiconductor device excellent in folding endurance

Flexible copper clad laminate, flexible printed wiring board obtain...

Two-layer flexible printed wiring board and method for manufacturin...