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Hiroaki MACHITANI
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wired circuit board, casing, and board containing set
Patent number
11,910,526
Issue date
Feb 20, 2024
Nitto Denko Corporation
Hayato Takakura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring circuit board and producing method thereof
Patent number
11,825,598
Issue date
Nov 21, 2023
Nitto Denko Corporation
Ryosuke Sasaoka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring circuit board
Patent number
11,272,615
Issue date
Mar 8, 2022
Nitto Denko Corporation
Naoki Shibata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ASSEMBLY SHEET
Publication number
20240107679
Publication date
Mar 28, 2024
Nitto Denko Corporation
Kenya TAKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING CIRCUIT BOARD
Publication number
20230240007
Publication date
Jul 27, 2023
Nitto Denko Corporation
Daigo TSUBAI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING CIRCUIT BOARD
Publication number
20230098947
Publication date
Mar 30, 2023
Nitto Denko Corporation
Shusaku SHIBATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRED CIRCUIT BOARD, CASING, AND BOARD CONTAINING SET
Publication number
20220287177
Publication date
Sep 8, 2022
Nitto Denko Corporation
Hayato TAKAKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
Publication number
20220192010
Publication date
Jun 16, 2022
Nitto Denko Corporation
Ryosuke SASAOKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING CIRCUIT BOARD
Publication number
20210212208
Publication date
Jul 8, 2021
Nitto Denko Corporation
Naoki SHIBATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR