Hiroaki Okamoto

Person

Yamaguchi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 7,284,320
- Issue date Oct 23, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabrication method therefor
- Patent number 7,183,190
- Issue date Feb 27, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered metal laminate and process for producing the same
- Patent number 7,175,919
- Issue date Feb 13, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas separating unit and method for manufacturing the same
- Patent number 7,033,641
- Issue date Apr 25, 2006
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Clad plate for forming interposer for semiconductor device, interpo...
- Patent number 6,949,412
- Issue date Sep 27, 2005
- Toyo Kohan Co.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, metal laminated plate for fabricating circuit...
- Patent number 6,841,877
- Issue date Jan 11, 2005
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clad plate for forming interposer for semiconductor device, interpo...
- Patent number 6,838,318
- Issue date Jan 4, 2005
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming protective coating on cell safety valve element,...
- Patent number 6,818,342
- Issue date Nov 16, 2004
- Toyo Kohan Co., Ltd.
- Hiroaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Safety device for sealed battery and sealed battery using it
- Patent number 6,632,559
- Issue date Oct 14, 2003
- Toyo Kohan Co., Ltd.
- Hiroaki Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosed cell and sealer
- Patent number 6,531,242
- Issue date Mar 11, 2003
- Toyo Kohan, Ltd.
- Yoshiyuki Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20050193555
- Publication date Sep 8, 2005
- TOYO KOHAN CO., LTD
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated plate and part using the laminated plate
- Publication number 20050164006
- Publication date Jul 28, 2005
- Kinji Saijo
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of forming protective coating on cell safety valve element,...
- Publication number 20050084743
- Publication date Apr 21, 2005
- TOYO KOHAN CO., LTD
- Hiroaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas separating unit and method for manufacturing the same
- Publication number 20050076779
- Publication date Apr 14, 2005
- Kinji Saijo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
High polymer plate and conductive plate connecting body, and part u...
- Publication number 20040175583
- Publication date Sep 9, 2004
- Kinji Saijo
- B32 - LAYERED PRODUCTS
Information Patent Application
Hollow laminate and heat sink using the same
- Publication number 20040069463
- Publication date Apr 15, 2004
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered metal laminate and process for producing the same
- Publication number 20040065717
- Publication date Apr 8, 2004
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film with multilayered metal and process for producing the same
- Publication number 20040038050
- Publication date Feb 26, 2004
- Kinji Saijo
- B32 - LAYERED PRODUCTS
Information Patent Application
Clad plate for forming interposer for semiconductor device, interpo...
- Publication number 20030186484
- Publication date Oct 2, 2003
- TOYO KOHAN LTD.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and fabrication method therefor
- Publication number 20030155662
- Publication date Aug 21, 2003
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20030133277
- Publication date Jul 17, 2003
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, metal laminated plate for fabricating circuit...
- Publication number 20030134497
- Publication date Jul 17, 2003
- Kinji Saijo
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki Okamoto

Person

Patents Grantslast 30 patents

Multilayer printed wiring board and method of manufacturing the same

Semiconductor device and fabrication method therefor

Multilayered metal laminate and process for producing the same

Gas separating unit and method for manufacturing the same

Clad plate for forming interposer for semiconductor device, interpo...

Semiconductor device, metal laminated plate for fabricating circuit...

Clad plate for forming interposer for semiconductor device, interpo...

Method of forming protective coating on cell safety valve element,...

Safety device for sealed battery and sealed battery using it

Enclosed cell and sealer

Patents Applicationslast 30 patents

Multilayer printed wiring board and method of manufacturing the same

Laminated plate and part using the laminated plate

Method of forming protective coating on cell safety valve element,...

Gas separating unit and method for manufacturing the same

High polymer plate and conductive plate connecting body, and part u...

Hollow laminate and heat sink using the same

Multilayered metal laminate and process for producing the same

Film with multilayered metal and process for producing the same

Clad plate for forming interposer for semiconductor device, interpo...

Semiconductor device and fabrication method therefor

Multilayer printed wiring board and method of manufacturing the same

Semiconductor device, metal laminated plate for fabricating circuit...