Hiroaki Okudaira

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 7,709,746
- Issue date May 4, 2010
- Renesas Technology Corp.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing an electronic device having a PB free solder co...
- Patent number 7,013,564
- Issue date Mar 21, 2006
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 6,960,396
- Issue date Nov 1, 2005
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control system
- Patent number 5,510,976
- Issue date Apr 23, 1996
- Hitachi, Ltd.
- Naoki Tanaka
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electroless gold plating solution, method of plating with gold by u...
- Patent number 5,202,151
- Issue date Apr 13, 1993
- Hitachi, Ltd.
- Jiro Ushio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution and method for plating gold there...
- Patent number 5,198,273
- Issue date Mar 30, 1993
- Hitachi, Ltd.
- Setsuo Ando
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device plated with gold by means of an electroless gold...
- Patent number 4,963,974
- Issue date Oct 16, 1990
- Hitachi, Ltd.
- Jiro Ushio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for preparing superconductive wiring board
- Patent number 4,913,769
- Issue date Apr 3, 1990
- Hitachi, Ltd.
- Naoya Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic recording medium having an amorphous, nonmagnetic nickel-t...
- Patent number 4,735,853
- Issue date Apr 5, 1988
- Hitachi, Ltd.
- Hiroaki Okudaira
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20060115994
- Publication date Jun 1, 2006
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020163085
- Publication date Nov 7, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020019077
- Publication date Feb 14, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technical field
- Publication number 20020009610
- Publication date Jan 24, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki Okudaira

Person

Patents Grantslast 30 patents

Pb-free solder-connected structure

Pb-free solder-connected structure and electronic device

Pb-free solder-connected structure and electronic device

Method of producing an electronic device having a PB free solder co...

Pb-free solder-connected structure and electronic device

Control system

Electroless gold plating solution, method of plating with gold by u...

Electroless gold plating solution and method for plating gold there...

Electronic device plated with gold by means of an electroless gold...

Process for preparing superconductive wiring board

Magnetic recording medium having an amorphous, nonmagnetic nickel-t...

Patents Applicationslast 30 patents

Pb-FREE SOLDER-CONNECTED STRUCTURE

Pb-free solder-connected structure and electronic device

Pb-free solder-connected structure and electronic device

Pb-free solder-connected structure and electronic device

Pb-free solder-connected structure and electronic device

Technical field