Hiroaki Takano

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Hirakata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flow soldering process and apparatus
- Patent number 6,805,282
- Issue date Oct 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuji Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic circuit board
- Patent number 6,657,135
- Issue date Dec 2, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonded structure and electronic circuit board
- Publication number 20020187689
- Publication date Dec 12, 2002
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux applying method, flow soldering method and devices therefor an...
- Publication number 20020179690
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for flow soldering
- Publication number 20020179693
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR