Hiroaki Tsuyoshi

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Omiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a printed wiring board
- Patent number 9,338,898
- Issue date May 10, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Joji Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-coated copper foil for multilayer printed wiring board and mu...
- Patent number 6,165,617
- Issue date Dec 26, 2000
- Mitsui Mining and Smelting Co., Ltd.
- Tetsurou Satoh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed wiring board and process for manufacturing the same
- Patent number 5,800,722
- Issue date Sep 1, 1998
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki Tsuyoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20180223412
- Publication date Aug 9, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi MOGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER...
- Publication number 20130247373
- Publication date Sep 26, 2013
- Joji FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR