Hiroaki UMEDA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Shield package
- Patent number 12,016,165
- Issue date Jun 18, 2024
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shield package and method of manufacturing shield package
- Patent number 11,510,349
- Issue date Nov 22, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,414,554
- Issue date Aug 16, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,370,926
- Issue date Jun 28, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat dissipation material adhering composition, heat dissipation ma...
- Patent number 11,236,227
- Issue date Feb 1, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Shield package
- Patent number 11,191,198
- Issue date Nov 30, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation substrate, heat dissipation circuit structure body...
- Patent number 10,893,603
- Issue date Jan 12, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive coating material for shielding electronic component pack...
- Patent number 10,259,952
- Issue date Apr 16, 2019
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing resin impregnated material, composite mater...
- Patent number 10,059,083
- Issue date Aug 28, 2018
- Tatsuta Electric Wire & Cable Co., Ltd.
- Haruyuki Yoshigahara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer wiring board
- Patent number 9,420,706
- Issue date Aug 16, 2016
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,756,805
- Issue date Jun 24, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste multilayered board including the conductive paste...
- Patent number 7,214,419
- Issue date May 8, 2007
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste...
- Patent number 5,779,941
- Issue date Jul 14, 1998
- Tatsuta Electric Wire and Cable Co., Ltd.
- Hiroaki Umeda
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...
- Publication number 20230151228
- Publication date May 18, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shield Package
- Publication number 20220030751
- Publication date Jan 27, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Shield Package and Method of Manufacturing Shield Package
- Publication number 20210076544
- Publication date Mar 11, 2021
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299523
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299524
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD PACKAGE
- Publication number 20200288608
- Publication date Sep 10, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...
- Publication number 20200084875
- Publication date Mar 12, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20190292381
- Publication date Sep 26, 2019
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime Nakazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...
- Publication number 20180298185
- Publication date Oct 18, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD
- Publication number 20180222152
- Publication date Aug 9, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATER...
- Publication number 20180086025
- Publication date Mar 29, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Haruyuki Yoshigahara
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE COATING MATERIAL FOR SHIELDING ELECTRONIC COMPONENT PACK...
- Publication number 20170247550
- Publication date Aug 31, 2017
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140138126
- Publication date May 22, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20120037409
- Publication date Feb 16, 2012
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive paste multilayered board including the conductive paste...
- Publication number 20060057340
- Publication date Mar 16, 2006
- TATSUTA ELECTRIC WIRE & CABLE CO.,
- Hiroaki Umeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hiroaki UMEDA

Person

Patents Grantslast 30 patents

Shield package

Shield package and method of manufacturing shield package

Conductive coating material and production method for shielded pack...

Conductive coating material and production method for shielded pack...

Heat dissipation material adhering composition, heat dissipation ma...

Shield package

Heat dissipation substrate, heat dissipation circuit structure body...

Conductive coating material for shielding electronic component pack...

Method of manufacturing resin impregnated material, composite mater...

Multilayer wiring board

Method of manufacturing multilayer printed wiring board

Conductive paste multilayered board including the conductive paste...

1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste...

Patents Applicationslast 30 patents

CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...

Shield Package

Shield Package and Method of Manufacturing Shield Package

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

SHIELD PACKAGE

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...

RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD

METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATER...

CONDUCTIVE COATING MATERIAL FOR SHIELDING ELECTRONIC COMPONENT PACK...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...

Conductive paste multilayered board including the conductive paste...