Hiroaki Yamamoto

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Miyazaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor wafers
- Patent number 6,245,678
- Issue date Jun 12, 2001
- Komatsu Electronic Metals Co., Ltd.
- Hiroaki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mirror-polished surface wafers and method for manufac...
- Patent number 6,234,873
- Issue date May 22, 2001
- Komatsu Electronic Metals Co., Ltd.
- Hiroaki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating direct-bonded semiconductor wafers
- Patent number 5,932,048
- Issue date Aug 3, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hiroshi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating SOI substrate
- Patent number 5,863,829
- Issue date Jan 26, 1999
- Komatsu Electronic Metals Co., Ltd.
- Yuichi Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS