Hirochika Narita

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device for releasing heat generated in the amplifier unit of a soli...
- Patent number 8,031,244
- Issue date Oct 4, 2011
- Renesas Electronics Corporation
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensing apparatus and package of same
- Patent number 7,868,447
- Issue date Jan 11, 2011
- Renesas Electronics Corporation
- Hirochika Narita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resin molded semiconductor device and mold
- Patent number 7,448,861
- Issue date Nov 11, 2008
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adherence of a solid-state image-sensing device to a substrate
- Patent number 7,435,948
- Issue date Oct 14, 2008
- NEC Electronics Corporation
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a solid-state image-sensing device includin...
- Patent number 7,348,532
- Issue date Mar 25, 2008
- NEC Electronics Corporation
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device
- Patent number 7,265,444
- Issue date Sep 4, 2007
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
- Publication number 20110244619
- Publication date Oct 6, 2011
- RENESAS ELECTRONICS CORPORATION
- Hirochika NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSING APPARATUS AND PACKAGE OF SAME
- Publication number 20090224394
- Publication date Sep 10, 2009
- NEC ELECTRONICS CORPORATION
- Hirochika NARITA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20080174684
- Publication date Jul 24, 2008
- NEC Electronics Corporation
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a solid-state image-sensing device, and sol...
- Publication number 20060263942
- Publication date Nov 23, 2006
- NEC ELECTRONICS CORPORATION
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state image-sensing device
- Publication number 20060261250
- Publication date Nov 23, 2006
- NEC ELECTRONICS CORPORATION
- Hirochika Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20060071321
- Publication date Apr 6, 2006
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20040262741
- Publication date Dec 30, 2004
- NEC ELECTRONICS CORPORATION
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS

Hirochika Narita

Person

Patents Grantslast 30 patents

Device for releasing heat generated in the amplifier unit of a soli...

Solid-state image sensing apparatus and package of same

Resin molded semiconductor device and mold

Adherence of a solid-state image-sensing device to a substrate

Method of manufacturing a solid-state image-sensing device includin...

Resin molded semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE

SOLID-STATE IMAGE SENSING APPARATUS AND PACKAGE OF SAME

SOLID-STATE IMAGING DEVICE

Method of manufacturing a solid-state image-sensing device, and sol...

Solid-state image-sensing device

Resin molded semiconductor device and mold

Resin molded semiconductor device and mold